University of Hong Kong JSP-ADB MS Scholarship 2025 in Urban Planning
Hong Kong – Aspiring urban planners from developing countries across Asia and the Pacific have a golden opportunity to advance their careers with the Asian Development Bank-Japan Scholarship Program (ADB-JSP). The program, offered in partnership with the University of Hong Kong (HKU), is now accepting applications for its Master of Urban Design program.
“This scholarship program represents a significant investment in the future of urban planning in the region,” said a spokesperson for HKU. “We are proud to partner with ADB-JSP to provide talented individuals with the skills and knowledge necessary to address the complex challenges of urbanization.”
The ADB-JSP, established in 1988, aims to support human resource development in ADB member countries. The scholarship provides comprehensive financial assistance, covering tuition fees, a monthly living allowance, books, medical insurance, and travel expenses.
To be eligible, applicants must be citizens of an ADB borrowing member country, hold a bachelor’s degree with a strong academic record, and have at least two years of relevant work experience. Fluency in English and a commitment to return to their home country to contribute to national development are also essential requirements.
“We are looking for highly motivated individuals with a passion for urban planning and a strong desire to make a difference in their communities,” added the HKU spokesperson.
The selection process prioritizes candidates with outstanding academic qualifications, a demonstrated commitment to development, and the potential to assume leadership roles in their respective fields. Diversity and financial need are also taken into consideration.
Interested candidates are encouraged to apply through HKU’s admissions website (https://www.arch.hku.hk/programmes/upad/master-of-urban-design/scholarship/) before the January 28th deadline. This is a unique opportunity to gain a world-class education in urban design and contribute to building a more sustainable and resilient future for Asia and the Pacific.
The deadline for applications is noon HKT on January 28, 2025.
